The automatic edge cleaning machine for laminated silicon wafers is equipped with a high-speed galvanometer optical system to remove the excess film layer around the coated silicon wafer. The rotating processing platform and visual alignment systems effectively ensure the equipment beat and accuracy. The automatic loading and unloading structure meets the needs of online mass production

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Advantage

1. Second-level switching: supports one-click switching of PERC/TOPCon/HJT/perovskite stacking processes, and the conversion time is less than 5 minutes.
2. Zero consumable loss: non-contact edge cleaning technology, the annual consumable cost is reduced by 90%+ compared with traditional mechanical solutions.
3. Ultra-thin limit: suitable for non-destructive edge cleaning of silicon wafers below 150μm, the fragmentation rate is less than 0.05%, breaking through the bottleneck of the stacking process.
4. Fully automated production: equipped with loading and unloading basket conveying structure, belt conveyor line, mechanical regular structure and silicon wafer cache mechanism.
5. Dust collection: integrated negative pressure dust removal + electrostatic adsorption, eliminating the cost of post-cleaning.
6. Customization of edge cleaning area: open edge cleaning path to support customers to define the process independently.

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Highlights

1. Multiple groups of loading and unloading basket cache structures, high equipment fault tolerance;
2. Uniquely designed visual positioning system, greatly improving the accuracy of the engraving line position;
3. High-speed galvanometer optical system, etching speed up to 60m/s, fast beat, high output
4. The software is highly open source, the process can be edited independently, and it can meet different process requirements.

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Features

1. Fully automatic operation mode
2. Advanced machine vision positioning system, equipped with high-precision CCD camera. Used for silicon wafer positioning and processing
3. Equipped with many mechanical systems such as loading and unloading basket conveying structure, belt conveyor line, mechanical regularization structure, silicon wafer cache mechanism, rotating processing platform and NG handling system
4. Ultrafast laser and high-speed galvanometer field mirror system
5. Fast etching speed, small heat-affected area, no damage to the substrate

Applications

1. Perovskite stacked silicon wafer battery edge cleaning
2. Suitable for R&D and small batches
3. For other battery materials, please consult our relevant personnel

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Specifications
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1. Product size: 10mm*105mm/182mm*105mm
2. Industrial camera equipped with high-magnification telecentric lens, CCD positioning accuracy ≤±3μm
3. Processing object: silicon wafer or stacked battery semi-finished product
4. Production capacity (automation); 1500 pieces/hour @210*105mm, edge cleaning width 1mm
5. Product thickness: 110±5um (100±10um)
6. Edge cleaning width: 1±0.025mm (0.5-2mm)
7. Processing type: Linear filling and edge cleaning
8. Processing speed: ≤60m/s
9. Single line width ≤30μm±5μm
10. Single-side heat-affected area ≤30μm
11. Positioning accuracy 30um (±10um)
12. Processable file formats: standard Gerber files, DXF files, DWG files, etc.
13. Windows11 control PC, 21.5-inch monitor
14. TeamViewer remote access
15. Installation and training by Microtreat staff on site
16. Dust is collected by dust collector, exhaust flow: >200m3/h, duct diameter: ￠100mm
17. Compressed air Pressure: 0.5～0.7Mpa, flow rate: <200L/min, compressed air pipe diameter: ￠10mm
18. Marble base and metal welded frame
19. Ground feet with seismic isolation function
20. Overall dimensions: 5600mm×1690mm×1950mm, 4500kg
21. Rated power 44KW
22. 3-color status signal tower
23. Interlock or Sensor installed at all door panel positions

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Why Choose Us?

As a?national high-tech enterprise?specializing in photovoltaic manufacturing equipment, we bring cutting-edge innovation to silicon wafer edge cleaning technology. Our dedicated R&D team has developed?industry-leading laser processing solutions, supported by:

Process Expertise: 5+ years experience in PERC/TOPCon/HJT/perovskite processes
Production Validation: Equipment deployed in 10+ GW-level production lines
Technical Leadership: 50+ patents in laser precision processing technology
Customization Capability: Tailored solutions for 150μm ultra-thin wafers

??Mass Production Ready: 1,500 wafers/hour throughput with ≤±3μm accuracy
??Zero-Damage Guarantee: <0.05% breakage rate certified by TüV testing
??Complete Support: From installation to after-sales technical service

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Options

1. Local power
>480V/60Hz
2. Multiple laser wavelengths for optimal material absorption
>355nm 15W output power
>532nm 15W output power
3. Lasers with different pulse widths: picosecond, femtosecond and other ultrafast lasers
4. Contact us to learn about your specific needs